| Catalog Number | ACM58130033-2 |
|---|---|
| Product Name | Polydimethylsiloxane, methacryloxypropyl terminated; 4 - 6 cSt |
| CAS Number | 58130-03-3 |
| Synonyms | Methacrylate Functional Silicone Oil; Poly(Dimethylsiloxane), Methacryloxypropyl Terminated |
| Molecular Weight | 460.8g/mol |
| Boiling Point | > 205 °C |
| Melting Point | < -60 °C |
| Flash Point | > 110 °C |
| Appearance | Pale yellow Clear liquid. |
| Complexity | 549 |
| Compound Is Canonicalized | Yes |
| Covalently-Bonded Unit Count | 1 |
| Defined Atom Stereocenter Count | 0 |
| Defined Bond Stereocenter Count | 0 |
| Exact Mass | 460.21326859g/mol |
| Formal Charge | 0 |
| Heavy Atom Count | 29 |
| Hydrogen Bond Acceptor Count | 6 |
| Hydrogen Bond Donor Count | 0 |
| Isotope Atom Count | 0 |
| Linear Formula | C20H40O6Si3 |
| Monoisotopic Mass | 460.21326859g/mol |
| MW (10³) | 0.38-0.55 |
| Refractive Index | 1.448 |
| Relative Density | 0.97 |
| Rotatable Bond Count | 16 |
| Topological Polar Surface Area | 71.1Ų |
| Undefined Atom Stereocenter Count | 0 |
| Undefined Bond Stereocenter Count | 0 |
| Viscosity Kinematic | 4 - 6 cSt |
| Volatiles | < 5 % |
What is the IUPAC name of Polydimethylsiloxane, methacryloxypropyl terminated?
The IUPAC name of Polydimethylsiloxane, methacryloxypropyl terminated is 3-[[[dimethyl-[3-(2-methylprop-2-enoyloxy)propyl]silyl]oxy-dimethylsilyl]oxy-dimethylsilyl]propyl 2-methylprop-2-enoate.
What is the InChI of Polydimethylsiloxane, methacryloxypropyl terminated?
The InChI of Polydimethylsiloxane, methacryloxypropyl terminated is InChI=1S/C20H40O6Si3/c1-17(2)19(21)23-13-11-15-27(5,6)25-29(9,10)26-28(7,8)16-12-14-24-20(22)18(3)4/h1,3,11-16H2,2,4-10H3.
What is the InChIKey of Polydimethylsiloxane, methacryloxypropyl terminated?
The InChIKey of Polydimethylsiloxane, methacryloxypropyl terminated is DDHQGOQEUJIUOC-UHFFFAOYSA-N.
What is the Canonical SMILES of Polydimethylsiloxane, methacryloxypropyl terminated?
The Canonical SMILES of Polydimethylsiloxane, methacryloxypropyl terminated is CC(=C)C(=O)OCCC[Si](C)(C)O[Si](C)(C)O[Si](C)(C)CCCOC(=O)C(=C)C.
What is the molecular formula of Polydimethylsiloxane, methacryloxypropyl terminated?
The molecular formula of Polydimethylsiloxane, methacryloxypropyl terminated is C20H40O6Si3.
What is the CAS number of Polydimethylsiloxane, methacryloxypropyl terminated?
The CAS number of Polydimethylsiloxane, methacryloxypropyl terminated is 58130-03-3.
How many Hydrogen Bond Donor Count does Polydimethylsiloxane, methacryloxypropyl terminated have?
Polydimethylsiloxane, methacryloxypropyl terminated has 0 Hydrogen Bond Donor Count.
How many Hydrogen Bond Acceptor Count does Polydimethylsiloxane, methacryloxypropyl terminated have?
Polydimethylsiloxane, methacryloxypropyl terminated has 6 Hydrogen Bond Acceptor Count.
What is the molecular weight of Polydimethylsiloxane, methacryloxypropyl terminated?
The molecular weight of Polydimethylsiloxane, methacryloxypropyl terminated is 460.8 g/mol.
Is Polydimethylsiloxane, methacryloxypropyl terminated canonicalized?
Yes, Polydimethylsiloxane, methacryloxypropyl terminated is canonicalized.
Jung, Ho Yong, et al. Journal of Vacuum Science & Technology B 27.4 (2009): 1861-1864.
Polydimethylsiloxane, methacryloxypropyl terminated (M-PDMS)-based UV-curable liquid-phase imprinting resin and polyvinyl alcohol PVA bottom layer were applied to double-layer UV-NIL for a high-fidelity lift-off process. The M-PDMS-based imprinted resist pattern showed high etch resistance to O2 plasma, and the undercut pattern profile of the PVA bottom layer for the lift-off process was formed by the O2 RIE process. The size and shape of the imprinted resist pattern barely changed during PVA underlayer etching with O2 RIE. High corrosion resistance using double-layer UV-NIL and M-PDMS-based imprinting resin. High O2 RIE etch selectivity of the imprinted resist pattern to the underlying layer is necessary to create the undercut pattern profile, which is critical for a stable lift-off process.
Water-soluble polyvinyl alcohol PVA was used as the base layer of the double-layer UV-NIL. The UV-curable resin used in this study was formulated to meet requirements such as high O plasma etchability, good adhesion to the underlying layer, and low viscosity to minimize residual layers after the imprinting process. The composition of the imprinting resin is 94 wt% polydimethylsiloxane, methacryloxypropyl terminated as the base resin. 3 wt% UV initiator and 3 wt% methacryloyloxypropyltrichlorosilane, which can combine with the hydroxyl groups on the PVA bottom layer to improve the adhesion between the resin and the substrate.
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